Founded in 1937, DISCO can look back on 80 years of company history. The rapid development of the semiconductor industry and the digitization of information have advanced the requirements for the abrasive and precision industry. By rapidly adapting to market needs and delivering on-demand technologies, DISCO Corporation has established itself as a market leader in dicing (Kiru), grinding (Kezuru) and polishing (Migaku) technologies. Today, DISCO Corporation has over 50 affiliates in 16 countries worldwide. The DISCO Headquarter is located in Omori, Tokyo. To access further product and application information or to learn more about DISCO’s corporate philosophy and affiliates, please visit www.disco.co.jp.
For application support, dicing-grinding process/DISCO product consultation or any other question