NEWS

partnership-evatec-ag

15.10.2019 | Company

Partnership Evatec AG

We are really proud to announce our new partnership with Evatec AG for the post process of "sputtering".

partnership-muehlbauer

15.10.2019 | Company

Partnership Mühlbauer

We are happy to announce that we will be able to offer the post process of Pick and Place through our cooperation with Mühlbauer.

29.05.2019 | Events

LASER World of PHOTONICS 2019

Visit DISCO HI-TEC EUROPE at our booth 300 in hall A3 from June 24th-27th

22.05.2019 | Events

IMAPS MiNaPAD Grenoble 2019

Get to know our advanced semiconductor wafer and substrate dicing, grinding and processing technology at IMAPS MiNaPAD Grenoble

29.03.2019 | Company

Girlsday 2019

For the first time, we opened our doors to girls of all ages and educational backgrounds on "Girlsday" at the 28th march 2019.

29.03.2019 | Events

Munich's "Tag der Betriebe" 2019

2019 was the third time for DISCO Hi-TEC Europe in taking part at the "Tag der Betriebe" in Munich.

 

SEMICON Europa DISCI HI-TEC EUROPE booth

20.10.2018 | Events

SEMICON Europa/ Productronica 2018

DISCO HI-TEC Europe can be found at booth 501 in hall A4 where we will present our latest innovations in Kiru, Kezuru & Migaku. We are looking forward to meeting you!

16.05.2018 | Events

DISCO HI-TEC EUROPE at NordPac by IMAPS Nordic

Meet us in Oulu, Finlad to discuss latest dicing-grinding innovations and solutions for advanced packaging: 12th- 14th June 2018

Send us your service request now 

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