29.05.2019 | Events
Visit DISCO HI-TEC EUROPE at our booth 300 in hall A3 from June 24th-27th
22.05.2019 | Events
Get to know our advanced semiconductor wafer and substrate dicing, grinding and processing technology at IMAPS MiNaPAD Grenoble
29.03.2019 | Company
For the first time, we opened our doors to girls of all ages and educational backgrounds on "Girlsday" at the 28th march 2019.
29.03.2019 | Events
2019 was the third time for DISCO Hi-TEC Europe in taking part at the "Tag der Betriebe" in Munich.
20.10.2018 | Events
DISCO HI-TEC Europe can be found at booth 501 in hall A4 where we will present our latest innovations in Kiru, Kezuru & Migaku. We are looking forward to meeting you!
16.05.2018 | Events
Meet us in Oulu, Finlad to discuss latest dicing-grinding innovations and solutions for advanced packaging: 12th- 14th June 2018
24.04.2018 | Events
View our new products and processes at IMAPS MiNaPAD in Grenoble at our booth number 2. Technical update will be given
06.04.2018 | Events
For the second time, DISCO HI-TEC EUROPE was partner in the Company Day “Tag der Betriebe” in Munich’s technical school
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