15.10.2019 | Company
We are really proud to announce our new partnership with Evatec AG for the post process of "sputtering".
We are happy to announce that we will be able to offer the post process of Pick and Place through our cooperation with Mühlbauer.
29.05.2019 | Events
Visit DISCO HI-TEC EUROPE at our booth 300 in hall A3 from June 24th-27th
22.05.2019 | Events
Get to know our advanced semiconductor wafer and substrate dicing, grinding and processing technology at IMAPS MiNaPAD Grenoble
29.03.2019 | Company
For the first time, we opened our doors to girls of all ages and educational backgrounds on "Girlsday" at the 28th march 2019.
29.03.2019 | Events
2019 was the third time for DISCO Hi-TEC Europe in taking part at the "Tag der Betriebe" in Munich.
20.10.2018 | Events
DISCO HI-TEC Europe can be found at booth 501 in hall A4 where we will present our latest innovations in Kiru, Kezuru & Migaku. We are looking forward to meeting you!
16.05.2018 | Events
Meet us in Oulu, Finlad to discuss latest dicing-grinding innovations and solutions for advanced packaging: 12th- 14th June 2018
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