Dicing-Grinding Service - Our Purpose

DISCO HI-TEC EUROPE's Dicing-Grinding Service (DGS) is an integral component of any manufacturing stage when it comes to high precision processing of ICs, MEMS, LEDs, other micro components and their inspection/metrology. As a complete service, DGS implements exact customer requirements as well as develops ideal material handling. Therefore, DGS combines the most applicable machining method, speed, blade, wheel and several other conditions. DGS is the most efficient partner for mass manufacturing, developing prototypes, product optimization, adding value and outsourcing dicing-grinding requirements to a flexible and dependable partner. All services are offered in combination with lamination, mounting and vacuum packaging of wafers.

Typical materials we process for up to 300mm diameter workpieces are:

●  Silicon and other semiconductors, e.g. low-k, compound semiconductors
●  Sapphire
●  Glass
●  SiC
●  Ceramics
●  GaAs
●  Quartz
●  Bonded Materials

Many others upon request- Contact us for consultation 

 

Metrology, AOI, Microscopy, white light, IR

 Quality Assurance

Metrology

DGS utilizes detailed examination of the product’s pre- and post-process condition to prove the excellent process quality.

Our 3D surface metrology system consisting of an IR/White Light enables the measurement of waferstacks, compound material, warpage and surface deviations. Measuring surface roughness can be achieved with Atomic Force Microscopy (AFM).

Automated Optical Inspection (AOI)

Profitability, security and reliability of products are vital. To enable that, AOI shifts into focus. AOI can be used for several applications like chipping/crack detection or wafer bumps. Advanced optics, 2D/3D options and comprehensive software enable various possibilities of defect detection applicable to any IC based structure.

 

 

For application support, dicing-grinding process/DISCO product consultation or any other question 

OUR NEW BROCHURE

DGS Dicing-Grinding Service