NEWS

29.05.2019 | Events

LASER World of PHOTONICS 2019

Visit DISCO HI-TEC EUROPE at our booth 300 in hall A3 from June 24th-27th

22.05.2019 | Events

IMAPS MiNaPAD Grenoble 2019

Get to know our advanced semiconductor wafer and substrate dicing, grinding and processing technology at IMAPS MiNaPAD Grenoble

29.03.2019 | Company

Girlsday 2019

For the first time, we opened our doors to girls of all ages and educational backgrounds on "Girlsday" at the 28th march 2019.

29.03.2019 | Events

Munich's "Tag der Betriebe" 2019

2019 was the third time for DISCO Hi-TEC Europe in taking part at the "Tag der Betriebe" in Munich.

 

SEMICON Europa DISCI HI-TEC EUROPE booth

20.10.2018 | Events

SEMICON Europa/ Productronica 2018

DISCO HI-TEC Europe can be found at booth 501 in hall A4 where we will present our latest innovations in Kiru, Kezuru & Migaku. We are looking forward to meeting you!

16.05.2018 | Events

DISCO HI-TEC EUROPE at NordPac by IMAPS Nordic

Meet us in Oulu, Finlad to discuss latest dicing-grinding innovations and solutions for advanced packaging: 12th- 14th June 2018

DISCO HI-TEC EUROPE am impas Minapad

24.04.2018 | Events

IMAPS MiNaPAD Grenoble, May 16th-17th 2018

 View our new products and processes at IMAPS MiNaPAD in Grenoble at our booth number 2. Technical update will be given 

06.04.2018 | Events

Munich's Company Day - Tag der Betriebe

For the second time, DISCO HI-TEC EUROPE was partner in the Company Day “Tag der Betriebe” in Munich’s technical school 

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