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DISCO HI-TEC EUROPE at NordPac by IMAPS Nordic

Meet us in Oulu, Finlad to discuss latest dicing-grinding innovations and solutions for advanced packaging: 12th- 14th June 2018

DISCO HI-TEC EUROPE at NordPac 2018 by IMAPS Nordic

We are happy to meet you in Oulu at the the Nordic Conference on Microelectronics Packaging, NordPac. We will give an overview on our newest processing solutions for advanced packaging. Our technical session will be an overview on thinning eWLB and WLCSP wafer with high bumps. Learn more about our unique patented processes and get in touch with our team.

Our technical session will take place on Thursday June 14th, 2018 at 9:25. During the day, please visit us at our booth number 4.

More Info on NordPac and IMAPS Nordic

Overview

For application support, dicing-grinding process/DISCO product consultation or any other question