DISCO HI-TEC EUROPE at NordPac by IMAPS Nordic
DISCO HI-TEC EUROPE at NordPac 2018 by IMAPS Nordic
We are happy to meet you in Oulu at the the Nordic Conference on Microelectronics Packaging, NordPac. We will give an overview on our newest processing solutions for advanced packaging. Our technical session will be an overview on thinning eWLB and WLCSP wafer with high bumps. Learn more about our unique patented processes and get in touch with our team.
Our technical session will take place on Thursday June 14th, 2018 at 9:25. During the day, please visit us at our booth number 4.
For application support, dicing-grinding process/DISCO product consultation or any other question