Dicing (Kiru) - Blade Dicing

Regarding the market’s demands for ever smaller devices, our dicing processes do not only reduce production costs for our customers, but also meet the end consumer’s needs. Different factors like thickness, wafer size, material, dicing streets or additional processing determine dicing parameters. DGS supports finding the most efficient option for any demand. Our dicing processes are easily adaptable to any size, material and shape of packaging such as rectangles or partial wafers. With DISCO dicing saws and dicing blades equipment we perform unrivaled accuracy results when it comes to wafer dicing. Beside blade dicing we offer several laser dicing solutions. 

Single Cut Wafer Dicing

Single Cut

Using the Single Cut, the workpiece is severed by a single full cut in only one process step. It is performed by Disco’s single or dual spindle dicing saws to reduce the process time. Best blade dicing parameters are identified by DISCO HI-TEC Europe.

Step cut for wafer, half cut and full cut

Step Cut

The Step Cut is performed by Disco’s dual spindle dicing saws. Each spindle is equipped with a different dicing blade. This process is a solution to many problems currently faced (e.g. backside chipping) and can be integral in achieving an acceptable process for many different applications and wafer singulation. 

Bevel cut with v-shaped blade, optimal process, two steps, two different ding blades

Bevel Cut

The Bevel Cut is a special step cut and is executed using a V-shaped dicing blade that produces a chamfer on the top side of the die, which eliminates the sharp corner and increases die strength when performing wafer dicing.

groove into the material, no cut, pattern grooving

Pattern Grooving

“Grooving” is a dicing technique that produces custom groove patterns on the workpiece instead of cutting through the material. It can be applied to piezoelectric ceramics (PZT) for Sonar arrays and other materials for producing waveguides.

chop into material from any point, exit at any point

Chopper Cut

During the chopper cut, the dicing blade enters the workpiece directly from the top at any selected position and exits along the same axis. There is no contact between dicing blade and the workpiece edge. The chopper cut technique allows for highly flexible dicing processes.

cirlce shaped cut, downsize wafers

Circle Cut - Wafer Downsizing

The Circle Cut is employed to reduce the diameter of a wafer. By circle cut technique, the dicing blade enters the wafer and the chuck table rotates until a smaller wafer is cut out. If required, a flat can be added at the edge of the wafer to keep the crystal orientation.

Edge Trimming for die strength

Edge trimming (by dicing)

Edge trimming can be performed either by dicing or by grinding. It is effective when it comes to enhancing the edge quality on a wafer that is bonded to a substrate. By edge trimming, the wafer is stabilized and fractures are prevented.

Ultrasonic dicing for wafer

Ultrasonic Dicing

Dicing with ultrasonic technology has been developed as an application to support the processing of electronic components (ceramic parts) and optical devices, discs and transmission components. Using ultrasonic technology enables the processing of materials reducing both backside and frontside chipping in different cases and is used, for instance, when processing silicon carbide. 

Send us your service request now 

Contact us

OUR NEW BROCHURE

DGS Dicing-Grinding Service

Download
Back to top