Using the Single Cut, the workpiece is severed by a single full cut in only one process step. It is performed by Disco’s single or dual spindle dicing saws to reduce the process time. Best blade dicing parameters are identified by DISCO HI-TEC Europe.
The Step Cut is performed by Disco’s dual spindle dicing saws. Each spindle is equipped with a different dicing blade. This process is a solution to many problems currently faced (e.g. backside chipping) and can be integral in achieving an acceptable process for many different applications and wafer singulation.
The Bevel Cut is a special step cut and is executed using a V-shaped dicing blade that produces a chamfer on the top side of the die, which eliminates the sharp corner and increases die strength when performing wafer dicing.
“Grooving” is a dicing technique that produces custom groove patterns on the workpiece instead of cutting through the material. It can be applied to piezoelectric ceramics (PZT) for Sonar arrays and other materials for producing waveguides.
During the chopper cut, the dicing blade enters the workpiece directly from the top at any selected position and exits along the same axis. There is no contact between dicing blade and the workpiece edge. The chopper cut technique allows for highly flexible dicing processes.
Circle Cut - Wafer Downsizing
The Circle Cut is employed to reduce the diameter of a wafer. By circle cut technique, the dicing blade enters the wafer and the chuck table rotates until a smaller wafer is cut out. If required, a flat can be added at the edge of the wafer to keep the crystal orientation.
Edge trimming (by dicing)
Edge trimming can be performed either by dicing or by grinding. It is effective when it comes to enhancing the edge quality on a wafer that is bonded to a substrate. By edge trimming, the wafer is stabilized and fractures are prevented.
Dicing with ultrasonic technology has been developed as an application to support the processing of electronic components (ceramic parts) and optical devices, discs and transmission components. Using ultrasonic technology enables the processing of materials reducing both backside and frontside chipping in different cases and is used, for instance, when processing silicon carbide.
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