Single Wafer Grinding
With single wafer grinding ultra-thin wafer grinding is possible. The wafer passes rough and fine grinding steps that reduce the thickness as required. Also different surface roughness may be achieved by selecting appropriate abrasive tools and processing.
Partial Wafer Grinding
Partial Wafer Grinding is an efficient grinding method to process broken or damaged wafers, or wafer sections. This technique can be employed to process wafers that had been damaged, or wafer sections that are still intact, thereby avoiding loss of the entire wafer material.
Individual Die (Chip) Grinding
DGS processes individual dies that are already separated from the substrate. This is primarily implemented when only single dies are available.
Edge Trimming (by Grinding)
Bonded wafer grinding or ultra-thin grinding may cause edge chipping which is one of the critical issues leading to wafer breakage. Chipping may be induced by the rounded profile of the wafer's outer edges. The edge trimming process eliminates the rounded profile of the outer edge ensuring edge strength and chipping decrease.
Poligrind / Ultrapoligrind
Poligrind is performed by Disco’s ultra-fine diamond abrasive tools. Compared to standard grinding, Poligrind delivers superior performance regarding die strength as well as excellent post-grinding surface condition. At the same time, Poligrind is a non-chemical stress-relief process, which has reduced environmental impact.
Surface roughness: Poligrind Ra: 9nm Ultrapoligrind Ra: 4nm.
TAIKO is a DISCO developed wafer back grinding method. By enabling an outer support ring to the wafer (the TAIKO ring, Japanese for drum), back grinding is performed on the inner circular area of the wafer, while leaving an edge of a few millimeters unprocessed. Taiko simplifies thin wafer handling and lowers warpage.
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