Laser Dicing - Unlocking Technological Potentials

Utilizing beneficial characteristics of laser energy, laser applications have developed as a highly promising area of DGS with great potential. Laser applications minimize kerf streets, thereby suiting special materials such as GaAs in MEMS LEDs and RF or SiC. Laser applications are the preferred solution when blade dicing reaches its limits. Further, working with laser technology provides a high degree of flexibility to die forms such as hexagonal dies and die composition while offering high processing speed. Laser technology is developing rapidly and so are we, taking full advantage of every innovation leap. View the DISCO laser saws use.

Stealth Laser Dicing (SD)

Stealth dicing is a zero-waste, dry process which does not require any cleaning. Kerf width can be drasticly reduced. Stealth Laser can be applied to multi-project-wafers (MPW) or MEMS and various materials, as the dry process suits products which have to be protected from water or contamination. SD is a two-stage process. Firstly, the laser beam is focused in the inside of the workpiece creating a so-called modified layer/SD layer. Secondly, in order to separate the dies, external force is applied to singulate the dies along the modified layer.

Stealth laser dicing is the optimal processing for SiC wich is a very demanding and hard material

Stealth Laser Dicing on SiC

SiC is a promising material for power devices due to its capability, breakdown voltage, high strength, cooling ability and reduction of power loss. However, due to its hardness, it is difficult to process. Chipping may occur using blade dicing on SiC. In some cases, metallic layer on the back side is prone to burring. Reducing blade rpm (rotation per minute) and cutting feed speed can help, but reduces productivity. Our solution: Stealth Dicing on SiC maintains high productivity and highest quality eliminating any burrs.

By laser ablation solid evaporates und sublimes, suitable for sapphires

Laser Ablation

Laser Ablation is implemented by focusing laser energy onto a minute area for a very short time. Thus, solid evaporates and sublimes. There are various types of laser ablation depending on material being processed and also type of processing application, such as laser grooving and scribing.

Laser Grooving

Laser grooving technique offers benefits particularly when dicing low-k-materials. First, the material, which is difficult to be processed by dicing blade, is removed by laser grooving. Laser grooving is followed by step cut or single cut by blade dicing. Chipping or delamination of the low-k layers is reduced to a minimum.

cutting DAF by laser for DBG shifted dies

Die Attach Film (DAF) Laser Cut

Die Attach Film (DAF) as the bonding material to stack thinned dies for 3D-Packaging is increasing. Cutting DAF after DBG process ist done by laser cut. The sigulated dies are shifted after DBG when removing the grinding tape and mounting on frame. Laser dicing is used to apply special alignment to the shifted dies which is impossible by blade dicing. 

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