Dicing-Grinding Service at DISCO EUROPE

DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction. 

SERVICES

Dicing

Dicing

Most Accurate Singulation

Grinding

Grinding

Thinner and Smarter

Polishing

Polishing

Adding Strength and Value

Laser

Laser

Unlocking Technological Potentials

Advanced Processes

Advanced Processes

Always One Step Ahead

Send us your service request now 

NEWS

16.05.2018 | Events

DISCO HI-TEC EUROPE at NordPac by IMAPS Nordic

Meet us in Oulu, Finlad to discuss latest dicing-grinding innovations and solutions for advanced packaging: 12th- 14th June 2018

DISCO HI-TEC EUROPE am impas Minapad

24.04.2018 | Events

IMAPS MiNaPAD Grenoble, May 16th-17th 2018    

 View our new products and processes at IMAPS MiNaPAD in Grenoble at our booth number 2. Technical update will be given 

OUR NEW BROCHURE

DGS Dicing-Grinding Service