Dicing-Grinding Service at
DISCO EUROPE

DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction. 

SERVICES

Dicing

Dicing

Most Accurate Singulation

Grinding

Grinding

Thinner and Smarter

Polishing

Polishing

Adding Strength and Value

Laser

Laser

Unlocking Technological Potentials

Advanced Processes

Advanced Processes

Always One Step Ahead

Metrology

Metrology

Additional Quality Steps

Send us your service request now 

NEWS

29.05.2019 | Events

LASER World of PHOTONICS 2019

Visit DISCO HI-TEC EUROPE at our booth 300 in hall A3 from June 24th-27th

SEMICON Europa DISCI HI-TEC EUROPE booth

20.10.2018 | Events

SEMICON Europa/ Productronica 2018

DISCO HI-TEC Europe can be found at booth 501 in hall A4 where we will present our latest innovations in Kiru, Kezuru & Migaku. We are looking forward to meeting you!

OUR NEW BROCHURE

DGS Dicing-Grinding Service

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