Dicing-Grinding Service at
DISCO EUROPE

DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction. 

SERVICES

Dicing

Dicing

Most Accurate Singulation

Grinding

Grinding

Thinner and Smarter

Polishing

Polishing

Adding Strength and Value

Laser

Laser

Unlocking Technological Potentials

Advanced Processes

Advanced Processes

Always One Step Ahead

Metrology

Metrology

Additional Quality Steps

Send us your service request now 

NEWS

29.05.2019 | Events

LASER World of PHOTONICS 2019

Visit DISCO HI-TEC EUROPE at our booth 300 in hall A3 from June 24th-27th

22.05.2019 | Events

IMAPS MiNaPAD Grenoble, May 22th-23th 2019

Get to know our advanced semiconductor wafer and substrate dicing, grinding and processing technology at IMAPS MiNaPAD Grenoble

 

OUR NEW BROCHURE

DGS Dicing-Grinding Service

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