Dicing-Grinding Service at
DISCO EUROPE

DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.

SERVICES

Dicing

Dicing

Most Accurate Singulation

Grinding

Grinding

Thinner and Smarter

Polishing

Polishing

Adding Strength and Value

Laser

Laser

Unlocking Technological Potentials

Advanced Processes

Advanced Processes

Always One Step Ahead

Metrology

Metrology

Additional Quality Steps

Send us your service request now

NEWS

SEMICON Europa DISCO HI-TEC EUROPE booth 2019

20.11.2019 | Events

SEMICON Europa 2019

DISCO HI-TEC EUROPE at SEMICON 2019

partnership-evatec-ag

15.10.2019 | Company

Partnership Evatec AG

We are really proud to announce our new partnership with Evatec AG for the post process of "sputtering".

OUR NEW BROCHURE

DGS Dicing-Grinding Service

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